Photoresist Dip Coating Machine

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Product Details:

Power 350 W
Usage Photoresist layer deposition via dip coating process
Display Digital touch panel
Voltage 220 V AC, 50/60 Hz
Product Type Photoresist Dip Coating Machine
Material Stainless steel, powder coated steel
Design Floor-standing with enclosed chamber
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Photoresist Dip Coating Machine Price And Quantity

Minimum Order Quantity 1 Unit

Dipping Speed Range 1 199 mm/min (programmable)
Max Substrate Size 6 inches
Withdrawal Speed 1 200 mm/min, adjustable
Coating Uniformity 2% across surface
Control Method Fully automated microcontroller based
Bath Capacity 2 liters
Environment Compatibility ISO Class 6 cleanroom compatible
Safety Features Overload protection, interlock mechanism
Operational Mode Manual and automatic modes
Exhaust System Built-in exhaust fan with HEPA filter
Number of Programs 50 programmable recipes

Photoresist Dip Coating Machine Product Specifications

Power Source Electric
Usage Photoresist layer deposition via dip coating process
Accuracy 1% uniformity across substrate
Design Floor-standing with enclosed chamber
Power 350 W
Product Type Photoresist Dip Coating Machine
Weight Approx. 85 kg
Dimension (L*W*H) 700 mm x 500 mm x 1200 mm
Display Digital touch panel
Voltage 220 V AC, 50/60 Hz
Illuminant Low-intensity LED (for visibility, not exposure)
Material Stainless steel, powder coated steel

Dipping Speed Range 1 199 mm/min (programmable)
Max Substrate Size 6 inches
Withdrawal Speed 1 200 mm/min, adjustable
Coating Uniformity 2% across surface
Control Method Fully automated microcontroller based
Bath Capacity 2 liters
Environment Compatibility ISO Class 6 cleanroom compatible
Safety Features Overload protection, interlock mechanism
Operational Mode Manual and automatic modes
Exhaust System Built-in exhaust fan with HEPA filter
Number of Programs 50 programmable recipes

Photoresist Dip Coating Machine Trade Information

Supply Ability 5 Unit Per Week
Delivery Time 4-5 Days
Main Export Market(s) Australia, South America, Eastern Europe, Western Europe, Middle East, Central America, Asia, North America, Africa
Main Domestic Market All India

Product Description

SPECIFICATIONS

The Machine is tabletop and compact.
A single operation unit designed for coating of photo resist laminate on copper clad.
The machine ensure uniform controlled thickness of Photo resist on copper clad.
Maximum Board size : 250mm x 300mm (10" x 12").
Tank Capacity : 2 liters.
Dips one PCB at a time.
Motorised lead screw system.
Micro switch to prevent motor from getting damage.
Electrical power : 230V/50Hz, 5ASocket required.

Advanced Substrate Handling and Versatility

This dip coating machine accommodates wafers and substrates up to 6 inches, delivering consistent coatings on a range of materials. Its programmable speed control allows users to tailor the deposition process, making it suitable for academic research, product development, and scalable manufacturing.

User-Friendly Automation and Controls

The fully automated, microcontroller-based system offers both manual and automatic operation modes through an intuitive digital touch panel display. With 50 programmable recipes, operators can streamline complex processes while ensuring repeatable, high-quality results with minimal manual intervention.

Built-In Safety and Cleanroom Compatibility

Engineered for safety and operational integrity, the machine features overload protection, interlocking mechanisms, and a HEPA-filtered exhaust to maintain a contaminant-free working environment, meeting ISO Class 6 cleanroom standards for sensitive photoresist applications.

FAQs of Photoresist Dip Coating Machine:

Q: How does the Photoresist Dip Coating Machine ensure uniform layer deposition?

A: The machine uses precise, programmable dip and withdrawal speeds along with fully automated control algorithms to achieve uniform photoresist layers, maintaining 2% coating uniformity and 1% across the substrate.

Q: What substrates can be processed with this dip coater, and what is the maximum size allowed?

A: This equipment can process a variety of flat substrates, such as silicon wafers or glass, up to a maximum size of 6 inches, making it ideal for semiconductor, MEMS, and related applications.

Q: When is it recommended to use the manual versus automatic operational modes?

A: Manual mode is useful during setup, maintenance, or experimental tweaking, while automatic mode is preferred for routine processes to maximize consistency, repeatability, and efficiency with stored recipes.

Q: Where can this photoresist coating machine be installed?

A: The machine is engineered for environments compliant with ISO Class 6 cleanroom requirements, including research labs, semiconductor fabrication facilities, and advanced manufacturing units.

Q: What is the process for programming and storing coating recipes on this device?

A: Operators can program up to 50 coating recipes via the digital touch panel interface, customizing parameters such as speed and dwell time, which can then be saved for instant recall and repeatable processing.

Q: How does the built-in exhaust and filtration system benefit users?

A: The integrated exhaust fan with HEPA filtration continuously removes harmful fumes and particulates, maintaining air quality and complying with cleanroom standards, protecting both users and sensitive samples.

Q: What are the main benefits of using this machine for photoresist deposition?

A: Major advantages include high uniformity across large substrates, automation for process consistency, safety features, environmental compatibility, and flexibility for diverse applications, enhancing productivity and product quality.

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